Fabrication Services

The most complete gerber manufacturing review in the industry!

Mass Design (an ISO 9001:2008 company) builds quality printed circuit boards for customers who value product reliability and timely delivery. We do a complete design review of all prototype and production boards utilizing our Computer Aided Manufacturing (CAM) review. With our design experience and our many years fabricating PCBs we eliminate many simple errors. This ensures that your PCB boards are fabricated correctly the first time, helping our customers time to market.

PCB Product Offerings :

Our Capabilities:

Here are our Printed Circuit Board Manufacturing Capabilities, If you have a board that falls outside of these parameters - send gerbers to mburns@massdesign.com and we will be happy to review it to see if we can fabricate it.

Mass Design - Capabilities

	Gerber & NC files:
	Preferred format		274-X (Embedded Apertures)
	Acceptable format		274-D, with aperture file
	Drill file		Excellon file, with X,Y Co-ordinates
			& tool sizes in the header
	Inner layer copper clad
	1/4 oz	1/2 oz	1 oz	2 oz	3 oz
	Planes	Planes	Planes	Planes	Planes
	Signals	Signals	Signals	Signals
	Outerlayer copper clad
	1/4 oz	1/2 oz	1 oz	2 oz	3 oz
	Etching - Conductor Width & Etch to Etch Spacing
	Finish trace size within 20% of supplied artwork
	1/4	1/2	1 oz	2 oz	3 oz
	.003 / .003	.004 / .005	.005 / .006	.007 / .009
	Layer Stack-up Specs (1/4, 1/2, & 1oz Clad) +/- 10%
	Finished Thickness			Number of layers
	.031			1 - 8
	.047			1 - 12
	.062			1 - 16
	.093-0.200			1 - 26
	Prepreg
	Laminate perMIL-P13949 and IPC-4101
	Material Used			Phenolic/Epoxy
	Glass types			106, 1080, 2116,7628
	Layer construction / Impedance Design
	Number of layers			0 to 26
	Panel Sizes			12x18, 16x18, 18x24
	Registration			+/- .003" of each other
	Minimum core thickness			.003"
	Minimum dielectric			.003"
	Impedance stack-up			Per Design
	Lamination
	Bow & Twist			.75 %
	Maximum number of layers:			26
	Maximum board thickness			.200"
	Panel thickness tolerance			+/-10%
	Drilling
	Finished drill hole tolerance			+/- .002"
	True position			.005"
	Max hole to finished board thickness ratio			1/10
	Minimum finished drill hole			.006
	Maximum drill hole size			.250
	Minimum slot width			.020
	Min. distance, edge to edge, from			.0125
	plated hole to circuitry
	Min. distance, edge to edge, from			.0125
	non-plated hole to circuitry
	Standard finished annular ring			.005
	Copper Plating
	Minimum in holes			.0008"
	Minimum on surface			.0008"
	Plating finishes
	(SMOBC) Soldermask over bare copper
	Hot Air Solder Level (HASL) SnPb
	Hot Air Solder Level (HASL) SN100CL (lead free)
	Immersion gold			Full body
	Electroless gold			Full body
	Electrolytic gold			Full body, hard & soft
	Gold Fingers			100 micro inches Nickel
	with 30 to 45 degree bevel			30 micro inches Au
	Immersion Tin
	OSP(Organic Solderability Preservative)
	Immersion Silver
	Soldermask / Legend - per  IPC-SM-840
	Nominal Thickness		.0004"
	Tolerance		Within +/- .003"
	Min. line required		.007"
	Photo-imagable		(LPI) Taiyo
	Soldermask Colors		Red, Green, Blue, Black
	Min. Pad Clearance		LPI .002"
	Legend Colors		White, Yellow, Black,
	Fabrication
	Tolerance on overall dimensions			+ / - .005"
	Maximum BOARD size			16.00" x 22.00"
	Minimum BOARD size			.250" x .250"
	Minimum inside radius			.015"
	Means of Fabrication			Rout,  Score
	Min. copper back set from cut line			Score = .018"
	Min. copper back set from cut line			Rout = .010"
	Other			C'Sink, C'Bore
				Edge milling, Beveling
	Tab Routing
	Space Between Boards			.100" (we will step & repeat)
	Border around pallet (rails)			.250"
	Number of tabs per board			4
	Overall minimum pallet size			Depends on panel size
	V-scoring
	Space Between Boards			0.0" (we will step & repeat)
	Border around pallet (rails)			.250"
	Electrical Test
	CAD Netlist Test IPC-356A (Multiple CAD formats accepted)
	Parameters compliant with IPC
	Probe testing down to .004" (features to .0015")
	Continuity			50-100 ohm (50 ohm std)
	Isolation			5-100 Mohm (10 Mohm std)
	Voltage			.5-100v (5v std)
	Minimum SFMT Pitch			.003"
	Laboratory
	Standard and thermal stress cross-section
	evaluation (IPC-6012)
	SEC testing when requested
	Layer construction verification
	U/L approved E100335			Click here for card