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Gerber & NC files: |
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Preferred format |
274-X (Embedded Apertures) |
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Acceptable format |
274-D, with aperture file |
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Drill file |
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Excellon file, with X,Y Co-ordinates |
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& tool sizes in the header |
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Inner layer copper clad |
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1/4 oz |
1/2 oz |
1 oz |
2 oz |
3 oz |
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Planes |
Planes |
Planes |
Planes |
Planes |
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Signals |
Signals |
Signals |
Signals |
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Outerlayer copper clad |
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1/4 oz |
1/2 oz |
1 oz |
2 oz |
3 oz |
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Etching - Conductor Width & Etch to Etch Spacing |
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Finish trace size within 20% of supplied artwork |
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1/4 |
1/2 |
1 oz |
2 oz |
3 oz |
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.003 / .003 |
.004 / .005 |
.005 / .006 |
.007 / .009 |
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Layer Stack-up Specs (1/4, 1/2, & 1oz Clad) +/- 10% |
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Finished Thickness |
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Number of layers |
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.031 |
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1 - 8 |
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.047 |
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1 - 12 |
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.062 |
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1 - 16 |
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.093-0.200 |
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1 - 26 |
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Prepreg |
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Laminate perMIL-P13949 and IPC-4101 |
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Material Used |
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Phenolic/Epoxy |
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Glass types |
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106, 1080, 2116,7628 |
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Layer construction / Impedance Design |
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Number of layers |
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0 to 26 |
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Panel Sizes |
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12x18, 16x18, 18x24 |
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Registration |
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+/- .003" of each other |
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Minimum core thickness |
.003" |
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Minimum dielectric |
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.003" |
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Impedance stack-up |
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Per Design |
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Lamination |
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Bow & Twist |
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.75 % |
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Maximum number of layers: |
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26 |
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Maximum board thickness |
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.200" |
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Panel thickness tolerance |
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+/-10% |
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Drilling |
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Finished drill hole tolerance |
+/- .002" |
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True position |
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.005" |
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Max hole to finished board thickness ratio |
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1/10 |
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Minimum finished drill hole |
.006 |
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Maximum drill hole size |
.250 |
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Minimum slot width |
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.020 |
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Min. distance, edge to edge, from |
.0125 |
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plated hole to circuitry |
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Min. distance, edge to edge, from |
.0125 |
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non-plated hole to circuitry |
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Standard finished annular ring |
.005 |
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Copper Plating |
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Minimum in holes |
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.0008" |
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Minimum on surface |
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.0008" |
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Plating finishes |
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(SMOBC) Soldermask over bare copper |
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Hot Air Solder Level (HASL) SnPb |
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Hot Air Solder Level (HASL) SN100CL (lead free) |
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Immersion gold |
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Full body |
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Electroless gold |
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Full body |
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Electrolytic gold |
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Full body, hard & soft |
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Gold Fingers |
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100 micro inches Nickel |
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with 30 to 45 degree bevel |
30 micro inches Au |
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Immersion Tin |
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OSP(Organic Solderability Preservative) |
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Immersion Silver |
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Soldermask / Legend - per IPC-SM-840 |
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Nominal Thickness |
.0004" |
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Tolerance |
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Within +/- .003" |
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Min. line required |
.007" |
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Photo-imagable |
(LPI) Taiyo |
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Soldermask Colors |
Red, Green, Blue, Black |
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Min. Pad Clearance |
LPI .002" |
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Legend Colors |
White, Yellow, Black, |
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Fabrication |
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Tolerance on overall dimensions |
+ / - .005" |
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Maximum BOARD size |
16.00" x 22.00" |
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Minimum BOARD size |
.250" x .250" |
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Minimum inside radius |
.015" |
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Means of Fabrication |
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Rout, Score |
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Min. copper back set from cut line |
Score = .018" |
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Min. copper back set from cut line |
Rout = .010" |
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Other |
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C'Sink, C'Bore |
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Edge milling, Beveling |
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Tab Routing |
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Space Between Boards |
.100" (we will step & repeat) |
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Border around pallet (rails) |
.250" |
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Number of tabs per board |
4 |
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Overall minimum pallet size |
Depends on panel size |
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V-scoring |
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Space Between Boards |
0.0" (we will step & repeat) |
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Border around pallet (rails) |
.250" |
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Electrical Test |
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CAD Netlist Test IPC-356A (Multiple CAD formats accepted) |
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Parameters compliant with IPC |
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Probe testing down to .004" (features to .0015") |
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Continuity |
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50-100 ohm (50 ohm std) |
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Isolation |
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5-100 Mohm (10 Mohm std) |
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Voltage |
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.5-100v (5v std) |
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Minimum SFMT Pitch |
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.003" |
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Laboratory |
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Standard and thermal stress cross-section |
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evaluation (IPC-6012) |
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SEC testing when requested |
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Layer construction verification |
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U/L approved E100335 |
Click here for card |
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