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| The most complete gerber manufacturing review in the industry! |
Mass Design (an ISO 9001:2000 company) builds quality printed circuit boards for customers who value product reliability and timely delivery. We do a complete design review of all prototype and production boards utilizing our Computer Aided Manufacturing (CAM) review. With our design experience and our many years fabricating PCBs we eliminate many simple errors. This ensures that your PCB boards are fabricated correctly the first time, helping our customers time to market.
PCB Product Offerings :
Quick-turn orders- 1-5 day turns
Prototype & Production
High temperature boards
Single-sided, double-sided, multilayer up to 26 layers
A wide choice of materials (some examples):
- FR-4 Tg 140
- FR-4 Tg 170
- FR-4 Tg170 (RoHS Compliant)
- Polyimide
- Nelco
- Rogers
- GETEK
- Teflon
Lead and lead-free finishes
Blind and buried micro vias
Controlled Impedance Full electrical testing of boardsPCB Stencils
Our Capabilities:
Here are our Printed Circuit Board Manufacturing Capabilities, If you have a board that falls outside of these parameters - send gerbers to mburns@massdesign.com and we will be happy to review it to see if we can fabricate it.
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Mass Design - Capabilities |
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Gerber & NC files: |
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Preferred format |
274-X (Embedded Apertures) |
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Acceptable format |
274-D, with aperture file |
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Drill file |
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Excellon file, with X,Y Co-ordinates |
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& tool sizes in the header |
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Inner layer copper clad |
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1/4 oz |
1/2 oz |
1 oz |
2 oz |
3 oz |
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Planes |
Planes |
Planes |
Planes |
Planes |
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Signals |
Signals |
Signals |
Signals |
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Outerlayer copper clad |
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1/4 oz |
1/2 oz |
1 oz |
2 oz |
3 oz |
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Etching - Conductor Width & Etch to Etch Spacing |
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Finish trace size within 20% of supplied artwork |
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1/4 oz |
1/2 oz |
1 oz |
2 oz |
3 oz |
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.004 / .005 |
.004 / .005 |
.005 / .006 |
.007 / .009 |
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Layer Stack-up Specs (1/4, 1/2, & 1oz Clad) +/- 10% |
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Finished Thickness |
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Number of layers |
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.031 |
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1 - 8 |
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.047 |
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1 - 12 |
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.062 |
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1 - 16 |
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.093-0.200 |
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1 - 26 |
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Prepreg |
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Laminate perMIL-P13949 and IPC-4101 |
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Material Used |
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Tetra-functional |
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Glass types |
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106, 1080, 2116,7628 |
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Layer construction / Impedance Design |
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Number of layers |
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0 to 26 |
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Panel Sizes |
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12x18, 16x18, 18x24 |
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Registration |
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+/- .003" of each other |
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Minimum core thickness |
.004" |
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Minimum dielectric |
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.005" |
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Impedance stack-up |
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Per Design |
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Lamination |
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Bow & Twist |
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.75 % |
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Maximum number of layers: |
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26 |
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Maximum board thickness |
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.200" |
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Panel thickness tolerance |
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+/-10% |
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Drilling |
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Finished drill hole tolerance |
+/- .002" |
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True position |
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.005" |
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Max hole to finished board thickness ratio |
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1/10 |
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Minimum finished drill hole |
.010 |
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Maximum drill hole size |
.250 |
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Minimum slot width |
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.020 |
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Min. distance, edge to edge, from |
.0125 |
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plated hole to circuitry |
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Min. distance, edge to edge, from |
.0125 |
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non-plated hole to circuitry |
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Standard finished annular ring |
.008 |
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Copper Plating |
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Minimum in holes |
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.0008" |
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Minimum on surface |
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.0008" |
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Plating finishes |
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(SMOBC) Soldermask over bare copper |
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Hot Air Solder Level (HASL) SnPb |
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Hot Air Solder Level (HASL) SnAgCu (lead free) |
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Immersion gold |
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Full body |
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Electroless gold |
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Full body |
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Electrolytic gold |
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Full body, hard & soft |
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Gold Fingers |
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100 micro inches Nickel |
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with 30 to 45 degree bevel |
30 micro inches Au |
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White Tin Immersion |
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Soldermask / Legend - per IPC-SM-840 |
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Nominal Thickness |
.0004" |
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Tolerance |
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Within +/- .003" |
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Min. line required |
.007" |
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Photo-imagable |
(LPI) Taiyo |
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Soldermask Colors |
Red, Green, Blue, Black |
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Min. Pad Clearance |
LPI .002" |
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Legend Colors |
White, Yellow, Black, |
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Fabrication |
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Tolerance on overall dimensions |
+ / - .005" |
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Maximum BOARD size |
16.00" x 22.00" |
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Minimum BOARD size |
.250" x .250" |
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Minimum inside radius |
.015" |
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Means of Fabrication |
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Rout, Score |
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Min. copper back set from cut line |
Score = .018" |
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Min. copper back set from cut line |
Rout = .010" |
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Other |
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C'Sink, C'Bore |
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Edge milling, Beveling |
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