Capabilities
The most complete Gerber manufacturing review in the industry!
Mass Design builds quality printed circuit boards for customers who value product reliability and timely delivery. We do a complete design review of all prototype and production boards utilizing our Computer Aided Manufacturing (CAM) review. With our design experience and our many years fabricating PCBs we eliminate many simple errors. This ensures that your PCB boards are fabricated correctly the first time, helping our customers time to market. We are ISO 9001:2008 and ISO 13485 Certified.
PCB Product Offerings
Quick-turn orders- 1-5 day turns
Prototype & Production
High temperature boards
Single-sided, double-sided, multilayer up to 26 layers
Flex and Rigid Flex
A wide choice of materials (some examples):
FR-4 Tg 140
FR-4 Tg 170
FR-4 Tg170 (RoHS Compliant)
Polyimide
Nelco 4000-13
Rogers
GETEK
PTFE
Ceramic filled laminate
Aluminum clad laminates
Lead and lead-free finishes
Blind and buried micro vias
Conductive and non conductive filled vias
Controlled Impedance
Full electrical testing of boards
PCB Stencils
Capabilities & Specifications
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Gerber & NC files: |
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Preferred format |
274-X (Embedded Apertures) |
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Acceptable format |
274-D, with aperture file |
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Drill file |
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Excellon file, with X,Y Co-ordinates |
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& tool sizes in the header |
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Inner layer copper clad |
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1/4 oz |
1/2 oz |
1 oz |
2 oz |
3 oz |
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Planes |
Planes |
Planes |
Planes |
Planes |
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Signals |
Signals |
Signals |
Signals |
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Outerlayer copper clad |
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1/4 oz |
1/2 oz |
1 oz |
2 oz |
3 oz |
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Etching - Conductor Width & Etch to Etch Spacing |
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Finish trace size within 20% of supplied artwork |
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1/4 |
1/2 |
1 oz |
2 oz |
3 oz |
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.003 / .003 |
.004 / .005 |
.005 / .006 |
.007 / .009 |
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Layer Stack-up Specs (1/4, 1/2, & 1oz Clad) +/- 10% |
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Finished Thickness |
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Number of layers |
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.031 |
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1 - 8 |
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.047 |
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1 - 12 |
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.062 |
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1 - 16 |
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.093-0.200 |
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1 - 26 |
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Prepreg |
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Laminate perMIL-P13949 and IPC-4101 |
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Material Used |
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Phenolic/Epoxy |
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Glass types |
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106, 1080, 2116,7628 |
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Layer construction / Impedance Design |
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Number of layers |
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2 to 26 |
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Panel Sizes |
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12x18, 16x18, 18x24 |
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Registration |
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+/- .003" of each other |
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Minimum core thickness |
.003" |
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Minimum dielectric |
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.003" |
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Impedance stack-up |
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Per Design |
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Lamination |
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Bow & Twist |
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.75 % |
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Maximum number of layers: |
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26 |
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Maximum board thickness |
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.200" |
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Panel thickness tolerance |
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+/-10% |
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Drilling |
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Finished drill hole tolerance |
+/- .002" |
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True position |
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.005" |
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| Max hole to finished board thickness ratio | 1/10 | |||||
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Minimum finished drill hole |
.006 |
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Maximum drill hole size |
.250 |
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Minimum slot width |
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.020 |
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Min. distance, edge to edge, from |
.0125 |
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plated hole to circuitry |
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Min. distance, edge to edge, from |
.0125 |
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non-plated hole to circuitry |
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Standard finished annular ring |
.005 |
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Copper Plating |
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Minimum in holes |
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.0008" |
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Minimum on surface |
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.0008" |
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Plating finishes |
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(SMOBC) Soldermask over bare copper |
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Hot Air Solder Level (HASL) SnPb |
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Hot Air Solder Level (HASL) SN100CL (lead free) |
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Immersion gold |
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Full body |
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Electroless gold |
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Full body |
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Electrolytic gold |
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Full body, hard & soft |
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Gold Fingers |
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100 micro inches Nickel |
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with 30 to 45 degree bevel |
30 micro inches Au |
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| Immersion Tin | ||||||
| OSP(Organic Solderability Preservative) | ||||||
| Immersion Silver | ||||||
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Soldermask / Legend - per IPC-SM-840 |
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Nominal Thickness |
.0004" |
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Tolerance |
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Within +/- .003" |
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Min. line required |
.007" |
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Photo-imagable |
(LPI) Taiyo |
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Soldermask Colors |
Red, Green, Blue, Black |
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Min. Pad Clearance |
LPI .002" |
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Legend Colors |
White, Yellow, Black, |
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Fabrication |
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Tolerance on overall dimensions |
+ / - .005" |
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Maximum BOARD size |
16.00" x 22.00" |
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Minimum BOARD size |
.250" x .250" |
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Minimum inside radius |
.015" |
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Means of Fabrication |
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Rout, Score |
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Min. copper back set from cut line |
Score = .018" |
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Min. copper back set from cut line |
Rout = .010" |
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Other |
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C'Sink, C'Bore |
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Edge milling, Beveling |
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Tab Routing |
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Space Between Boards |
.100" (we will step & repeat) |
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Border around pallet (rails) |
.250" |
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Number of tabs per board |
4 |
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Overall minimum pallet size |
Depends on panel size |
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V-scoring |
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Space Between Boards |
0.0" (we will step & repeat) |
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Border around pallet (rails) |
.250" |
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Electrical Test |
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CAD Netlist Test IPC-356A (Multiple CAD formats accepted) |
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Parameters compliant with IPC |
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Probe testing down to .004" (features to .0015") |
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Continuity |
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50-100 ohm (50 ohm std) |
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Isolation |
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5-100 Mohm (10 Mohm std) |
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Voltage |
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.5-100v (5v std) |
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Minimum SFMT Pitch |
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.003" |
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Laboratory |
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Standard and thermal stress cross-section |
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evaluation (IPC-6012) |
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SEC testing when requested |
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Layer construction verification |
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U/L approved E100335 |
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