Capabilities

The most complete Gerber manufacturing review in the industry!

Mass Design builds quality printed circuit boards for customers who value product reliability and timely delivery. We do a complete design review of all prototype and production boards utilizing our Computer Aided Manufacturing (CAM) review. With our design experience and our many years fabricating PCBs we eliminate many simple errors. This ensures that your PCB boards are fabricated correctly the first time, helping our customers time to market. We are ISO 9001:2008 and ISO 13485 Certified.

PCB Product Offerings

Quick-turn orders- 1-5 day turns
Prototype & Production
High temperature boards
Single-sided, double-sided, multilayer up to 26 layers
Flex and Rigid Flex
A wide choice of materials (some examples):
FR-4 Tg 140
FR-4 Tg 170
FR-4 Tg170 (RoHS Compliant)
Polyimide
Nelco 4000-13
Rogers
GETEK
PTFE
Ceramic filled laminate
Aluminum clad laminates
Lead and lead-free finishes
Blind and buried micro vias
Conductive and non conductive filled vias
Controlled Impedance
Full electrical testing of boards
PCB Stencils

Capabilities  & Specifications

 

 

 

 

 

 

 

 

Gerber & NC files:

 

 

 

 

 

Preferred format

274-X (Embedded Apertures)

 

 

Acceptable format

274-D, with aperture file

 

 

   

 

 

Drill file

 

Excellon file, with X,Y Co-ordinates

 

 

 

 

& tool sizes in the header

 

 

 

 

 

 

 

 

 

Inner layer copper clad

 

 

 

 

1/4 oz

1/2 oz

1 oz

2 oz

3 oz

 

 

Planes

Planes

Planes

Planes

Planes

 

 

Signals

Signals

Signals

Signals

 

 

 

 

 

 

 

 

 

 

Outerlayer copper clad

 

 

 

 

1/4 oz

1/2 oz

1 oz

2 oz

3 oz

 

 

 

 

 

 

 

 

 

Etching - Conductor Width & Etch to Etch Spacing

 

 

Finish trace size within 20% of supplied artwork

 

 

1/4

1/2

1 oz

2 oz

3 oz

 

 

.003 / .003

.004 / .005

.005 / .006

.007 / .009

 

 

 

 

 

 

 

 

 

 

Layer Stack-up Specs (1/4, 1/2, & 1oz Clad) +/- 10%

 

 

Finished Thickness

 

Number of layers

 

 

.031

 

 

1 - 8

 

 

 

.047

 

 

1 - 12

 

 

 

.062

 

 

1 - 16

 

 

 

.093-0.200

 

 

1 - 26

 

 

 

 

 

 

 

 

 

 

 

 

 

Prepreg

 

 

 

 

 

 

Laminate perMIL-P13949 and IPC-4101

 

 

 

Material Used

 

Phenolic/Epoxy

 

 

Glass types

 

106, 1080, 2116,7628

 

 

 

 

 

 

 

 

 

Layer construction / Impedance Design

 

 

 

Number of layers

 

2 to 26

 

 

 

Panel Sizes

 

12x18, 16x18, 18x24

 

 

Registration

 

+/- .003" of each other

 

 

Minimum core thickness

.003"

 

 

 

Minimum dielectric

 

.003"

 

 

 

Impedance stack-up

 

Per Design

 

 

 

 

 

 

 

 

 

Lamination

 

 

 

 

 

Bow & Twist

 

.75 %

 

 

 

Maximum number of layers:

 

 

26

 

 

 

Maximum board thickness

 

 

.200"

 

 

 

Panel thickness tolerance

 

 

+/-10%

 

 

 

 

 

 

 

 

 

 

Drilling

 

 

 

 

 

 

Finished drill hole tolerance

+/- .002"

 

 

 

True position

 

.005"

 

 

  Max hole to finished board thickness ratio   1/10    

 

Minimum finished drill hole

.006

 

 

 

Maximum drill hole size

.250

 

 

 

Minimum slot width

 

.020

 

 

 

Min. distance, edge to edge, from

.0125

 

 

 

plated hole to circuitry

 

 

 

 

Min. distance, edge to edge, from

.0125

 

 

 

non-plated hole to circuitry

 

 

 

 

Standard finished annular ring

.005

 

 

 

 

 

 

 

 

 

 

Copper Plating

 

 

 

 

 

Minimum in holes

 

.0008"

 

 

 

Minimum on surface

 

.0008"

 

 

 

 

 

 

 

 

 

 

Plating finishes

 

 

 

 

 

(SMOBC) Soldermask over bare copper

 

 

Hot Air Solder Level (HASL) SnPb

 

 

 

Hot Air Solder Level (HASL) SN100CL (lead free)

 

 

 

Immersion gold

 

Full body

 

 

 

Electroless gold

 

Full body

 

 

 

Electrolytic gold

 

Full body, hard & soft

 

 

Gold Fingers

 

100 micro inches Nickel

 

 

with 30 to 45 degree bevel

 30 micro inches Au

 

  Immersion Tin    
  OSP(Organic Solderability Preservative)    
  Immersion Silver    

 

 

 

 

 

 

 

 

Soldermask / Legend - per  IPC-SM-840

 

 

 

Nominal Thickness

.0004"

 

 

 

 

Tolerance

 

Within +/- .003"

 

 

 

Min. line required

.007"

 

 

 

 

Photo-imagable

(LPI) Taiyo

 

 

 

 

Soldermask Colors

Red, Green, Blue, Black

 

 

Min. Pad Clearance

LPI .002"

 

 

 

 

Legend Colors

White, Yellow, Black,

 

 

 

 

 

 

 

 

 

 

Fabrication

 

 

 

 

 

Tolerance on overall dimensions

+ / - .005"

 

 

 

Maximum BOARD size

16.00" x 22.00"

 

 

Minimum BOARD size

.250" x .250"

 

 

Minimum inside radius

.015"

 

 

 

Means of Fabrication

 

Rout,  Score

 

 

Min. copper back set from cut line

Score = .018"

 

 

Min. copper back set from cut line

Rout = .010"

 

 

Other

 

 

C'Sink, C'Bore

 

 

 

 

 

Edge milling, Beveling

 

 

 

 

 

 

 

 

 

Tab Routing

 

 

 

 

 

Space Between Boards

.100" (we will step & repeat)

 

 

Border around pallet (rails)

.250"

 

 

 

Number of tabs per board

4

 

 

 

Overall minimum pallet size

Depends on panel size

 

 

 

 

 

 

 

 

 

V-scoring

 

 

 

 

 

 

Space Between Boards

0.0" (we will step & repeat)

 

 

Border around pallet (rails)

.250"

 

 

 

 

 

 

 

 

 

 

Electrical Test

 

 

 

 

 

CAD Netlist Test IPC-356A (Multiple CAD formats accepted)

 

 

Parameters compliant with IPC

 

 

 

 

Probe testing down to .004" (features to .0015")

 

 

Continuity

 

 

50-100 ohm (50 ohm std)

 

 

Isolation

 

 

5-100 Mohm (10 Mohm std)

 

 

Voltage

 

 

.5-100v (5v std)

 

 

Minimum SFMT Pitch

 

.003"

 

 

 

 

 

 

 

 

 

 

Laboratory

 

 

 

 

 

Standard and thermal stress cross-section

 

 

 

evaluation (IPC-6012)

 

 

 

 

 

SEC testing when requested

 

 

 

 

Layer construction verification

 

 

 

 

U/L approved E100335

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