The most complete Gerber manufacturing review in the industry!


Mass Design builds quality printed circuit boards for customers who value product reliability and timely delivery. We do a complete design review of all prototype and production boards utilizing our Computer Aided Manufacturing (CAM) review. With our design experience and our many years fabricating PCBs we eliminate many simple errors. This ensures that your PCB boards are fabricated correctly the first time, helping our customers time to market. We are ISO 9001:2008 and ISO 13485 Certified.

  • PCB Product online discount Offerings
  • Quick-turn orders- 1-5 day turns
  • Prototype & Production
  • High temperature boards
  • Single-sided, double-sided, multilayer up to 26 layers
  • Flex and Rigid Flex
  • A wide choice of materials (some examples):
  • FR-4 Tg 140
  • FR-4 Tg 170
  • FR-4 Tg170 (RoHS Compliant)
  • Polyimide
  • Nelco 4000-13
  • Rogers
  • GETEK
  • PTFE
  • Ceramic filled laminate
  • Aluminum clad laminates
  • Lead and lead-free finishes
  • Blind and buried micro vias
  • Conductive and non conductive filled vias
  • Controlled Impedance
  • Full electrical testing of boards
  • PCB Stencils

 

Capabilities & Specifications

Gerber & NC files:
Preferred format 274-X (Embedded Apertures)
Acceptable format 274-D, with aperture file
Drill File Excellon file, with X, Y Co-ordinates & tool sizes in the header
Inner layer copper clad
1/4 oz 1/2 oz 1 oz 2 oz 3 oz
Planes Planes Planes Planes Planes
Signals Signals Signals Signals
Outer layer copper clad
1/4 oz 1/2 oz 1 oz 2 oz 3 oz
Etching - Conductor Width & Etch to Etch Spacing
Finish trace size within 20% of supplied artwork
1/4 oz 1/2 oz 1 oz 2 oz 3 oz
.003 / .003 .004 / .005 .005 / .006 .007 / .009
Layer Stack-up Specs (1/4, 1/2, & 1oz Clad) +/- 10%
Finished Thickness Number of layers
.031 1-8
.047 1-12
.062 1-16
.093-0.200 1-26
Prepreg
Laminate perMIL-p13949 and IPC-4101
Material Used Phenolic/Epoxy
Glass types 106, 1080, 2116, 7628
Layer construction / Impedance Design
Number of layers 2 to 26
Panel Sizes 12x18, 16x18, 18x24
Registration +/- .003" of each other
Minimum core thickness .003"
Minimum dielectric .003"
Impedance stack-up Per Design
Lamination
Bow & Twist .75%
Maximum number of layers: 26
Maximum board thickness .200"
Panel thickness tolerance +/- 10%
Drilling
Finished drill hole tolerance +/- .002"
True position .005"
Max hole to finished board thickness ratio 1/10
Maximum finished drill hole .006
Maximum drill hole size .250
Minimum slot width .020
Min. distance, edge to edge, from plated hole to circuitry .0125
Min. distance, edge to edge, from non-plated hole to circuitry .0125
Standard finished annular ring .005
Copper Plating
Minimum in holes .0008"
Minimum on surface .0008"
Plating finishes
(SMOBC) Soldermask over bare copper
Hot Air Solder Level (HASL) SnPb
Hot Air Solder Level (HASL) SN100CL (lead free)
Immersion gold Full body
Electroless gold Full body
Electrolytic gold Full body, hard & soft
Gold Fingers 100 micro inches Nickel
with 30 to 45 degree bevel 30 micro inches Au
Immersion Tin
OSP (Organic Solderability Preservative)
Immersion Silver
Plating finishes
(SMOBC) Soldermask over bare copper
Hot Air Solder Level (HASL) SnPb
Hot Air Solder Level (HASL) SN100CL (lead free)
Immersion gold Full body
Electroless gold Full body
Electrolytic gold Full body, hard & soft
Gold Fingers 100 micro inches Nickel
with 30 to 45 degree bevel 30 micro inches Au
Immersion Tin
OSP (Organic Solderability Preservative)
Immersion Silver
Soldermask / Legend - per IPC-SM-840
Nominal Thickness .0004"
Tolerance Within +/- .003"
Min. line required .007"
Photo-imagable (LPI) Taiyo
Soldermask Colors Red, Green, Blue, Black
Min. Pad Clearance LPI .002"
Legend Colors White, Yellow, Black
Fabrication
Tolerance on overall dimensions +/- .005"
Maximum BOARD size 16.00" x 22.00"
Minimum BOARD size .250" x .250"
Minimum inside radius .015"
Means of Fabrication Rout, Score
Min. copper back set from cut line Score = .018"
Min. copper back set from cut line Rout = .010"
Other C'Sink, C'Bore, Edge milling, Beveling
Tab Routing
Space Between Boards .100" (we will step & repeat)
Border around pallet (rails) .250"
Number of tabs per board 4
Overall minimum pallet size Depends on panel size
V-Scoring
Space Between Boards 0.0" (we will step & repeat)
Border around pallet (rails) .250"
Electrical Test
CAD Netlist Test IPC-356A (Multiple CAD formats accepted)
Parameters compliant with IPC
Probe testing down to .004" (features to .0015")
Continuity 50-100 ohm (50 ohm std)
Isolation 5-100 Mohm (10 Mohm std)
Voltage .5-100v (5v std)
Minimum SFMT Pitch .003"
Laboratory
Standard and thermal stress cross-section
evaluation (IPC-6012)
SEC testing when requested
Layer construction verification
U/L approved E100335

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