The most complete Gerber manufacturing review in the industry!

Mass Design builds quality printed circuit boards for customers who value product reliability and timely delivery. We do a complete design review of all prototype and production boards utilizing our Computer Aided Manufacturing (CAM) review. With our design experience and our many years fabricating PCBs we eliminate many simple errors. This ensures that your PCB boards are fabricated correctly the first time, helping our customers time to market. We are ISO 9001:2008 and ISO 13485 Certified.

PCB Product online discount Offerings
Quick-turn orders- 1-5 day turns
Prototype & Production
High temperature boards
Single-sided, double-sided, multilayer up to 26 layers
Flex and Rigid Flex
A wide choice of materials (some examples):
FR-4 Tg 140
FR-4 Tg 170
FR-4 Tg170 (RoHS Compliant)
Polyimide
Nelco 4000-13
Rogers
GETEK
PTFE
Ceramic filled laminate
Aluminum clad laminates
Lead and lead-free finishes
Blind and buried micro vias
Conductive and non conductive filled vias
Controlled Impedance
Full electrical testing of boards
PCB Stencils

Capabilities & Specifications

  
   Gerber & NC files:
  
    Preferred format
    274-X (Embedded Apertures)
  
    Acceptable format
    274-D, with aperture file
  
    Drill File
    Excellon file, with X, Y Co-ordinates & tool sizes in the header

  
   Inner layer copper clad 
  

    1/4 oz
    1/2 oz
    1 oz
    2 oz
    3 oz
  

    Planes
    Planes
    Planes
    Planes
    Planes
  

    Signals
    Signals
    Signals
    Signals
     
  

  
   Outer layer copper clad 
  

    1/4 oz
    1/2 oz
    1 oz
    2 oz
    3 oz
  

  
   Etching - Conductor Width & Etch to Etch Spacing 
  
Finish trace size within 20% of supplied artwork

    1/4 oz
    1/2 oz
    1 oz
    2 oz
    3 oz
  
    .003 / .003
    .004 / .005
    .005 / .006
    .007 / .009

  
   Layer Stack-up Specs (1/4, 1/2, & 1oz Clad) +/- 10% 
  
    Finished Thickness
    Number of layers
  
    .031
    1-8
  
    .047
    1-12
  
    .062
    1-16
  
    .093-0.200
    1-26

  
   Prepreg 
  
 Laminate perMIL-p13949 and IPC-4101 

    Material Used
    Phenolic/Epoxy
  
    Glass types
    106, 1080, 2116, 7628

  
   Layer construction / Impedance Design 
  
    Number of layers
    2 to 26
  
    Panel Sizes
    12x18, 16x18, 18x24, 24x30
  
    Registration
    +/- .003" of each other
  
    Minimum core thickness
    .003"
  
    Minimum dielectric
    .003"
  
    Impedance stack-up
    Per Design

  
   Lamination 
  
    Bow & Twist
    .75%
  
    Maximum number of layers:
    26
  
    Maximum board thickness
    .200"
  
    Panel thickness tolerance
    +/- 10%

  
   Drilling 
  
    Finished drill hole tolerance
    +/- .002"
  
    True position
    .005"
  
    Max hole to finished board thickness ratio
    1/10
  
    Maximum finished drill hole
    .006
  
    Maximum drill hole size
    .250
  
    Minimum slot width
    .020
  
    Min. distance, edge to edge, from plated hole to circuitry
    .0125
  
    Min. distance, edge to edge, from non-plated hole to circuitry
    .0125
  
    Standard finished annular ring
    .005

  
   Copper Plating 
  
    Minimum in holes
    .0008"
  
    Minimum on surface
    .0008"

  
   Plating finishes 
  
    (SMOBC) Soldermask over bare copper 
  
    Hot Air Solder Level (HASL) SnPb 
  
    Hot Air Solder Level (HASL) SN100CL (lead free) 
  
    Immersion gold
    Full body
  
    Electroless gold
    Full body
  
    Electrolytic gold
    Full body, hard & soft
  
    Gold Fingers
    100 micro inches Nickel
  
    with 30 to 45 degree bevel
    30 micro inches Au
  
    Immersion Tin
  
    OSP (Organic Solderability Preservative)
  
    Immersion Silver

  
   Plating finishes 
  
    (SMOBC) Soldermask over bare copper 
  
    Hot Air Solder Level (HASL) SnPb 
  
    Hot Air Solder Level (HASL) SN100CL (lead free) 
  
    Immersion gold
    Full body
  
    Electroless gold
    Full body
  
    Electrolytic gold
    Full body, hard & soft
  
    Gold Fingers
    100 micro inches Nickel
  
    with 30 to 45 degree bevel
    30 micro inches Au
  
    Immersion Tin
  
    OSP (Organic Solderability Preservative)
  
    Immersion Silver

  
     Soldermask / Legend - per IPC-SM-840 
  
    Nominal Thickness
    .0004"
  
    Tolerance
    Within +/- .003"
  
    Min. line required
    .007"
  
    Photo-imagable
    (LPI) Taiyo
  
    Soldermask Colors
    Red, Green, Blue, Black
  
    Min. Pad Clearance
    LPI .002"
  
    Legend Colors
    White, Yellow, Black

  
     Fabrication 
  
    Tolerance on overall dimensions
    +/- .005"
  
    Maximum BOARD size
    16.00" x 22.00"
  
    Minimum BOARD size
    .250" x .250"
  
    Minimum inside radius
    .015"
  
    Means of Fabrication
    Rout, Score
  
    Min. copper back set from cut line
    Score = .018"
  
    Min. copper back set from cut line
    Rout = .010"
  
    Other
    C'Sink, C'Bore, Edge milling, Beveling

  
     Tab Routing 
  
    Space Between Boards
    .100" (we will step & repeat)
  
    Border around pallet (rails)
    .250"
  
    Number of tabs per board
    4
  
    Overall minimum pallet size
    Depends on panel size

  
     V-Scoring 
  
    Space Between Boards
    0.0" (we will step & repeat)
  
    Border around pallet (rails)
    .250"

  
     Electrical Test 
  
    CAD Netlist Test IPC-356A (Multiple CAD formats accepted) 
  
    Parameters compliant with IPC
  
    Probe testing down to .004" (features to .0015")
  
    Continuity 
    50-100 ohm (50 ohm std)
  
    Isolation
    5-100 Mohm (10 Mohm std)
  
    Voltage
    .5-100v (5v std)
  
    Minimum SFMT Pitch
    .003"

  
     Laboratory 
  
    Standard and thermal stress cross-section
  
    evaluation (IPC-6012)
  
    SEC testing when requested
  
    Layer construction verification
  
    U/L approved E100335