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PCB Fabrication – Tailored Solutions for Every Design Challenge

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Expert PCB Solutions: Rigid, Flex, and More Since 1986

No matter how complex or simple your board design may be, we can provide a solution! We have been supplying Printed Circuit Boards to the electronics marketplace since 1986. In addition to Rigid PCBs, we also offer Mixed Mode Rigid/Flex, Flex, RF and Microwave. Our customers get real-time feedback on IPC driven constraints and limitations as they are encountered, enabling them to correct potential issues as they arise. This allows MDI to provide a product with a high degree of manufacturability, while identifying potential problems prior to final manufacturing.

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Let us help you bring your project to life!

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Rigid

  • Layer Count 1-40
  • Board Thickness 0.008” to 0.500”
  • Finished Copper Thickness 0.25 oz – 16 oz
  • Minimum Trace/Space Width 0.003” (0.08mm)
  • Plating HASL/Pb Free HASL, OSP, Immersion Gold/ENIG Immersion Silver and Hard Gold
  • Hole Location Tolerance 0.003” (0.08 mm)
  • Minimum Hole Size 0.006” (0.15mm) Mechanical / 0.003” (0.08mm) Laser
  • Buried Vias 0.006” (0.15mm) Minimum
  • Blind Vias 0.004” (0.1mm) Minimum 
  • Maximum Aspect Ratio 20:1
  • Materials FR-4, Polyimide, Nelco, Taconic, GETEK, PTFA, Aluminum Clad, RoHS Compliant, and many more.
  • Routing V-Score, Jump Score, Countersinks, Counter Bores and Edge Castellations

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Flex

  • IPC Types AvailableType 1, 2, 3 & 4 Layer Count 6 (Type 3) – 12 (Type 4)
  • Copper Thickness 0.5 oz – 4 oz
  • Minimum Hole Size 0.003” (0.08mm) Laser
  • Minimum Trace/Space Width 0.003” (0.08mm)
  • Minimum Dielectric Thickness 0.001”
  • Controlled Impedance Yes
  • Minimum Dielectrics 0.001”
  • Profile MethodPunch, Rout & Laser
  • Stiffeners Polyimide & FR-4

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RF/Microwave

  • Layer Count 1-40
  • Board Thickness 0.008” to 0.500”
  • Finished Copper Thickness 0.25 oz – 16 oz
  • Minimum Trace/Space Width 0.003” (0.08mm)
  • Plating HASL/Pb Free HASL, OSP, Immersion Gold/ENIG
  • Immersion Silver, Immersion Fingers, Hard Gold
  • Hole Location Tolerance 0.003” (0.08 mm)
  • Minimum Hole Size 0.006” (0.15mm) Mechanical / 0.003” (0.08mm) Laser
  • Buried Vias 0.006” (0.15mm) Minimum
  • Blind Vias 0.004” (0.1mm) Minimum
  • Maximum Aspect Ratio 20:1
  • Materials Polyimide, Nelco, Teflon, Rogers, Taconic, GETEK, PTFA, Ceramic Filled, RoHS Compliant, and more.
  • Routing V-Score, Jump Score, Countersinks, Counter Bores and Edge Castellations
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